The BM10B(0.8)-24DP-0.4 is a 24-position board-to-board connector from Hirose Electric Co. Ltd, part of the BM10 series. This connector is designed for high-density packaging and automated assembly in various electronic devices. Its compact size and reliable connection make it suitable for applications requiring a robust and space-efficient interconnect solution.

Applications:

• Mobile phones and smartphones
• Digital cameras and camcorders
• Laptop and tablet computers
• Wearable devices
• Medical devices
• Industrial control equipment

Features:

• Number of Positions: 24
• Pitch: 0.8mm
• Mounting Style: Surface Mount
• Mating Style: Board-to-Board
• Height: Low profile design for space saving
• Material: High-temperature resistant resin for reflow soldering
• Contact Material: Copper alloy for reliable electrical performance
• Termination Style: Solder

Benefits:

• High-Density Packaging: The 0.8mm pitch allows for a large number of connections in a small space, ideal for miniaturized devices.
• Reliable Connection: Ensures stable electrical contact, even under vibration and shock.
• Automated Assembly: Designed for automated pick-and-place and reflow soldering, reducing manufacturing costs and improving efficiency.
• Durable: Constructed with high-quality materials to withstand harsh environmental conditions and mechanical stress.
• Space Saving: Low profile design minimizes the overall height of the connection, making it suitable for thin devices.

Additional Details:

The BM10 series connectors are known for their robust design and suitability for demanding applications. The BM10B(0.8)-24DP-0.4 is designed to withstand reflow soldering temperatures and provides a secure connection. The connector's compact size and high pin count make it a popular choice for modern electronic devices where space is at a premium.