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GS881Z18BGD200

Part No GS881Z18BGD200
Manufacturer GSI Technology
Catalog RAM
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Address Bus Width 19 b
Case / Package FBGA
Density 9 Mb
Max Operating Temperature 70 °C
Min Operating Temperature 0 °C
Number of Ports 2
Radiation Hardening No
RoHS Compliant
Win Source Part Number 1197982-GS881Z18BGD200
Categories RAM
Manufacturer GSI Technology
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian GS881Z18BGD200 CAD Model

Description

The GS881Z18BGD200 is a high-speed synchronous burst SRAM (Static Random Access Memory) manufactured by GSI Technology. It is designed for applications requiring fast data access and high bandwidth, operating at a frequency of 200 MHz. This SRAM features an 18-bit data bus.

Applications

  • Networking Equipment: Routers, switches, and other network infrastructure.
  • Data Communication Systems: High-speed data transmission and reception.
  • Test and Measurement Equipment: Logic analyzers, oscilloscopes, and signal generators.
  • Image Processing: Real-time image and video processing applications.
  • High-Performance Computing: Servers, workstations, and embedded systems with demanding memory requirements.

Features

  • High Speed: 200 MHz operating frequency.
  • 18-Bit Data Bus: Wide data bus for increased bandwidth.
  • Synchronous Burst Architecture: Supports burst read and write operations for efficient data transfer.
  • LVTTL Compatible Inputs and Outputs: Compatible with standard logic levels.
  • JEDEC Standard Pinout: Simplifies board layout and design.

Benefits

  • Increased System Performance: Fast memory access improves overall application performance.
  • High Bandwidth: Enables high-speed data transfer.
  • Simplified Design: Standard pinout facilitates easy system integration.
  • Reliable Operation: Designed for robust performance in demanding environments.

The GS881Z18BGD200 likely utilizes advanced CMOS technology for low power consumption and high-speed operation. It likely supports various burst modes to optimize data throughput. The specific memory capacity, voltage requirements, and temperature range are typically detailed in the product datasheet. On-chip address and control logic is probably integrated to simplify memory management.

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