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IRFU230BTU

Part No IRFU230BTU
Manufacturer Fairchild/ON Semiconductor
Catalog Hard To Find
Sample
Rohs State Need to verify
ECAD Module
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Reference Date Code 05+
Reference case TO-251
Manufacturer Fairchild/ON Semiconductor
Manufacturer Homepage www.fairchildsemi.com
RoHS State Request Verification
Win Source Part Number 714571-IRFU230BTU
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian IRFU230BTU CAD Model

Description

The IRFU230BTU is an N-channel power MOSFET manufactured by Fairchild Semiconductor/ON Semiconductor. It is designed for high-speed switching applications and is commonly used in power supplies, motor control, and other power electronic circuits.

Applications

  • Switch Mode Power Supplies (SMPS)
  • DC-DC converters
  • Motor control
  • Uninterruptible Power Supplies (UPS)
  • Lighting ballasts

Features

  • Transistor Type: MOSFET
  • Channel Type: N-Channel
  • Drain-Source Voltage (Vdss): 200V
  • Continuous Drain Current (Id): 6.8A
  • Gate-Source Voltage (Vgs): ±20V
  • On-Resistance (Rds(on)): 0.4 Ohms (max) @ Vgs = 10V
  • Gate Charge (Qg): 12 nC (typical)
  • Package: TO-251 (IPAK)

Benefits

  • High Voltage Capability: The 200V Vdss allows for use in high-voltage applications.
  • Low On-Resistance: Minimizes power losses and improves efficiency.
  • Fast Switching Speed: Enables high-frequency operation, reducing the size and cost of passive components.
  • Ease of Use: Standard TO-251 package simplifies mounting and heatsinking.
  • Robust Design: Provides reliable performance in demanding applications.

Additional Details

The IRFU230BTU is designed for efficient power conversion and control. Its low on-resistance and fast switching speed contribute to reduced power losses and improved system efficiency. The device is typically mounted on a heatsink to dissipate heat generated during operation. Gate charge and capacitance characteristics are critical parameters for optimizing switching performance. The TO-251 package provides a good balance between thermal performance and size.

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