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EM63A165TSC-6G

Part No EM63A165TSC-6G
Manufacturer Etron Technology
Catalog Custom Parts (E - I)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1220138-EM63A165TSC-6G
Categories Custom Parts
Manufacturer Etron Technology
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian EM63A165TSC-6G CAD Model

Description

The EM63A165TSC-6G is a high-speed synchronous dynamic random-access memory (SDRAM) chip produced by Etron Technology. SDRAM is a type of dynamic RAM that synchronizes its operation with the system clock, which allows for faster data transfer rates compared to traditional asynchronous DRAM. This particular SDRAM chip is designed for applications requiring high bandwidth and relatively low latency.

Applications:

  • Embedded Systems: Suitable for embedded systems where real-time performance is critical, such as industrial automation or medical devices.
  • Graphics Cards: May be utilized as frame buffer memory in lower-end graphics cards or integrated graphics solutions.
  • Networking Equipment: Used in routers, switches, and other networking devices to buffer data packets and manage network traffic.
  • Digital Signal Processing (DSP): Can be implemented in DSP systems for data storage and processing in applications like audio and video processing.
  • Consumer Electronics: Could find use in certain consumer electronics products like set-top boxes or DVD players where fast memory access is beneficial.

Features:

  • SDRAM Technology: Employs synchronous dynamic RAM architecture for high-speed data transfers.
  • Memory Density: Offers a specific memory density to accommodate various data storage requirements. (16M x 16)
  • Clock Frequency: Operates at a defined clock frequency, impacting overall memory bandwidth. (166MHz)
  • Low Power Consumption: Designed for efficient power utilization, suitable for battery-powered applications.
  • Standard SDRAM Interface: Complies with standard SDRAM interface protocols for easy integration with memory controllers.
  • TSOP Package: Packaged in a Thin Small Outline Package (TSOP), enabling compact designs and surface mount assembly.

Benefits:

  • High Bandwidth: Provides a large data bandwidth for quick data transfer between memory and the processor.
  • Low Latency: Offers relatively low latency for rapid memory access and improved system responsiveness.
  • Power Efficiency: Contributes to lower power consumption, extending battery life in portable devices and reducing overall energy costs.
  • Easy Integration: Facilitates seamless integration with existing systems due to its adherence to standard SDRAM protocols.
  • Compact Form Factor: TSOP packaging allows for dense memory configurations within space-constrained designs.

Additional Details:

The EM63A165TSC-6G has a configuration of 16M x 16, meaning it's organized as 16 million memory locations, each holding 16 bits of data. The -6G portion of the part number often refers to the speed grade and temperature range. Consult the official Etron Technology datasheet for detailed specifications including timing parameters, voltage requirements, and thermal characteristics. SDRAM needs to be refreshed periodically to maintain data integrity. This refresh operation is typically handled automatically by the memory controller.

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