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Same model may have multiple batches, images only for reference.
S1C17F57D00E200
Same model may have multiple batches, images only for reference.

S1C17F57D00E200

Part No S1C17F57D00E200
Manufacturer Epson Electronics America Inc-Semiconductor Div
Catalog Embedded - Microcontrollers
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr Epson Electronics America Inc-Semiconductor Div
Package Tape & Reel (TR)
Product Status Obsolete
Core Processor S1C17
Core Size 16-Bit
Speed 4.2MHz
Connectivity I2C, IrDA, SPI, UART/USART
Peripherals PWM, WDT
Number of I/O 29
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 2K x 8
Supply Voltage - Operating 2V ~ 3.6V
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting SMD (SMT)
Package / Case Die
Standard Package 500
MSL Level 3 (168 Hours)
ECCN EAR99
HTSUS 8542.31.0001
Win Source Part Number 1264758-S1C17F57D00E200
Ultra Librarian 3D Model Ultra Librarian S1C17F57D00E200 CAD Model

Description

The Epson Electronics America Inc-Semiconductor Div S1C17F57D00E200 is an integrated circuit suitable for embedded microcontrollers. It has a 16-bit core size and a program memory size of 32KB. It also has connectivity features such as I2C, IrDA, SPI, and UART/USART. It is recommended to use a suitable alternative component.

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