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S1C17705F101100

Part No S1C17705F101100
Manufacturer Epson Electronics America Inc-Semiconductor Div
Catalog Embedded - Microcontrollers
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr Epson Electronics America Inc-Semiconductor Div
Package Tray
Core Processor S1C17
Core Size 16-Bit
Speed 8.2MHz
Connectivity I2C, IrDA, SPI, UART/USART
Peripherals LCD, PWM, WDT
Number of I/O 35
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
RAM Size 12K x 8
Supply Voltage - Operating 1.8V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Temperature Range - Operating -25°C ~ 70°C (TA)
Mounting SMD (SMT)
Package / Case 240-BFQFP
Base Product Number S1C17705
Standard Package 24
MSL Level 3 (168 Hours)
ECCN EAR99
HTSUS 8542.31.0001
Win Source Part Number 1264750-S1C17705F101100
Ultra Librarian 3D Model Ultra Librarian S1C17705F101100 CAD Model

Description

The Epson Electronics America Inc-Semiconductor Div S1C17705F101100 is a highly efficient and reliable microcontroller that is perfect for various embedded applications.

  • Core Processor: 16-bit
  • Speed: 8.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Program Memory Size: 512KB (512K x 8)
  • RAM Size: 12K x 8
  • Data Converter: A/D 8x10b
  • Oscillator Type: Internal

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