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S29GL256N11TFIV20

Part No S29GL256N11TFIV20
Manufacturer Cypress Semiconductor Corp
Catalog Unclassified Memory
Description IC FLASH 256MBIT PARALLEL 56TSOP  /  FLASH - NOR Memory IC 256Mb (32M x 8, 16M x 16) Parallel 110 ns 56-TSOP
Datasheet
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Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Memory
Mfr Cypress Semiconductor Corp
Series GL-N
Package Bulk
Product Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mb (32M x 8, 16M x 16)
Memory Interface Parallel
Write Cycle Time - Word, Page 110ns
Access Time 110 ns
Voltage - Supply 2.7V ~ 3.6V
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting SMD (SMT)
Package / Case 56-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 56-TSOP
Standard Package 1
MSL Level Vendor Undefined
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Win Source Part Number 1255081-S29GL256N11TFIV20
Ultra Librarian 3D Model Ultra Librarian S29GL256N11TFIV20 CAD Model

Description

The S29GL256N11TFIV20 is a 256 Mbit (32 MB) NOR flash memory device manufactured by Cypress Semiconductor Corp. It is designed for high-performance applications that require fast read speeds, execute-in-place (XIP) capabilities, and reliable data storage. This memory chip is often used in embedded systems, networking equipment, and industrial control systems.

Applications

  • Embedded systems for storing boot code, operating systems, and application data.
  • Networking equipment such as routers and switches for storing firmware and configuration settings.
  • Industrial control systems for storing program code and data logging.
  • Automotive applications for storing maps, navigation data, and firmware updates.

Features

  • 256 Mbit (32 MB) capacity
  • NOR flash architecture
  • Operating voltage: 2.7V to 3.6V
  • Operating temperature: -40°C to +85°C
  • Fast page mode read operation
  • Sector erase and chip erase operations
  • Common Flash Interface (CFI) for easy system integration
  • Package: 64-ball FBGA

Benefits

  • High Capacity: Provides sufficient storage space for code and data in embedded applications.
  • Fast Read Performance: Enables quick boot times and efficient code execution directly from flash memory.
  • Reliable Data Storage: Ensures data integrity and long-term storage stability.
  • Wide Operating Temperature Range: Operates reliably in harsh industrial and automotive environments.
  • Easy Integration: The Common Flash Interface simplifies system integration.
  • Low Power Consumption: Optimized for energy-efficient operation, crucial for battery-powered devices.

Additional Details

The S29GL256N11TFIV20 offers a combination of high capacity, fast read performance, and reliability, making it a suitable choice for a wide range of embedded applications. Its NOR flash architecture allows for random access reads, making it ideal for applications where code is executed directly from the flash memory. The device also supports sector erase and chip erase operations, providing flexibility in managing the memory contents. The 64-ball FBGA package allows for compact mounting on circuit boards. It's a robust and versatile memory solution for demanding applications.

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