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CYT4DNJBKCQ1BZSGST

Part No CYT4DNJBKCQ1BZSGST
Manufacturer Cypress Semiconductor Corp
Catalog OEM Souring
Description MCU
Sample
Rohs State rohs
ECAD Module
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Category OEM Souring
Win Source Part Number 1462645-CYT4DNJBKCQ1BZSGST
Manufacturer Cypress Semiconductor Corp
Package Tape & Reel (TR)
Product Status Active
Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size 32-Bit Tri-Core
Speed 100MHz, 320MHz
Connectivity CANbus, Ethernet, I²C, LINbus, SPI, UART/USART
Peripherals DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O 168
Program Memory Size 6.19MB (6.19M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 640K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 48x12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 105°C (TA)
Grade -
Mounting Type Surface Mount
Supplier Device Package 327-FBGA (17x17)
Package / Case 327-LFBGA
Ultra Librarian 3D Model Ultra Librarian CYT4DNJBKCQ1BZSGST CAD Model

Description

The CYT4DNJBKCQ1BZSGST microcontroller unit by Cypress, a company now under Infineon's umbrella, is engineered to cater to the sophisticated requirements of embedded applications requiring high levels of processing power, connectivity, and reliability. Though detailed specifications such as CPU architecture and memory allocations remain unspecified, Cypress's lineage suggests this MCU is likely based on an efficient ARM Cortex-M core, coupled with significant memory resources to accommodate complex applications and data-intensive tasks. The inclusion of advanced security measures, extensive communication protocol support, and a wide array of input and output options characterize Cypress's dedication to versatility and performance in their product range. This MCU is ideal for designers working on next-generation embedded solutions in sectors such as automotive, connectivity, and industrial control systems, where reliability, efficiency, and advanced functionality are paramount. Leveraging Cypress's robust design and technology, the CYT4DNJBKCQ1BZSGST is poised to drive innovation and efficiency in embedded systems development.

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