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Same model may have multiple batches, images only for reference.
CY7C2270KV18-550BZXI Real Image
Same model may have multiple batches, images only for reference.

CY7C2270KV18-550BZXI

Part No CY7C2270KV18-550BZXI
Manufacturer Cypress Semiconductor Corp
Catalog SRAM
Description IC SRAM 36MBIT PARALLEL 165FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 39 Weeks
Features SRAM - Synchronous, DDR II+ Memory IC 36Mb (1M x 36) Parallel 550 MHz 165-FBGA (13x15)
Manufacturer Cypress Semiconductor Corp
Package Tray
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 165-LBGA
Case / Package 165-FBGA (13x15)
Family Name CY7C2270
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number -CY7C2270KV18-550BZXI, CY7C2270KV18550BZXI
Quantity per package 136
Popularity High
Supply and Demand Status Balance
Win Source Part Number 916467-CY7C2270KV18-550BZXI
Ultra Librarian 3D Model Ultra Librarian CY7C2270KV18-550BZXI CAD Model

Description

Cypress Semiconductor Corp CY7C2270KV18-550BZXI is a DDR II+ Memory IC 36Mb (1M x 36) Parallel 550 MHz 165-FBGA (13x15) device.

  • Mounting: Surface Mount
  • Packaging: Tray
  • Family Name: CY7C2270
  • Case / Package: 165-FBGA (13x15)
  • Operating Temperature: -40°C to 85°C (TA)
  • Supply and Demand: Balance
  • Quantity per Package: 136
  • MSL Level: 3 (168 Hours)
  • Production Lead Time: Estimated 39 weeks
  • REACH Status: REACH unaffected
  • HTSUS: 8542.32.0041

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