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CL201209T-1R5K-N

Part No CL201209T-1R5K-N
Manufacturer Chilisin
Catalog OEM Parts (C - E)
Description 1.5UH 10% Q45 0.5? 50MA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 1052234-CL201209T-1R5K-N
Categories OEM Parts(C-E)
Manufacturer Chilisin
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CL201209T-1R5K-N CAD Model

Description

The CL201209T-1R5K-N is a multilayer chip inductor produced by Chilisin. It's designed for use in high-frequency circuits, serving functions such as filtering, impedance matching, and RF signal tuning. This inductor's compact size and performance characteristics make it suitable for a variety of modern electronic devices.

Applications:

  • Mobile communication devices
  • Wireless LAN (WLAN)
  • Bluetooth applications
  • GPS devices
  • RF transceivers

Features:

  • Small size (2012/0805 footprint)
  • High self-resonant frequency
  • Excellent Q factor
  • Surface mount technology (SMT)
  • Tight tolerance
  • RoHS compliant

Benefits:

  • Enables miniaturization of electronic circuits
  • Provides stable and reliable performance in high-frequency applications
  • Offers efficient signal filtering and impedance matching capabilities
  • Facilitates easy and cost-effective assembly on PCBs
  • Ensures consistent performance across various devices
  • Complies with environmental safety standards

Additional Details:

The CL201209T-1R5K-N has an inductance value of 1.5µH (microhenries). The 'K' likely indicates the tolerance code. It is designed for surface mount assembly. The inductor's high self-resonant frequency allows it to function effectively in high-frequency circuits without significant performance degradation. It provides the necessary inductance for filtering unwanted noise, impedance matching to optimize signal transfer, and tuning circuits to resonate at specific frequencies. The "N" likely refers to a specific packaging or material. This component is commonly used in smartphones, tablets, and other wireless devices to ensure optimal performance and signal integrity. The component is designed to be reflow soldered onto a PCB.

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