The QCPL-W661-560E is a high-performance, surface-mount chip LED manufactured by Avago Technologies (now Broadcom). It is designed for various indicator and display applications requiring high brightness and reliability.

Applications:

• Backlighting: LCD backlighting for mobile devices, industrial equipment, and automotive displays.
• Indicator lights: Status indicators for electronic devices, appliances, and industrial controls.
• Panel indicators: Displaying information on control panels and instrument panels.
• Automotive lighting: Interior lighting, dashboard indicators, and other automotive lighting applications.
• Signage: Indoor and outdoor signage, including channel letters and illuminated displays.

Features:

• High brightness: Provides excellent visibility even in bright ambient light.
• Wide viewing angle: Offers a wide viewing angle for optimal visibility from different positions.
• Surface mount package: Suitable for automated assembly processes.
• Compact size: Allows for use in space-constrained applications.
• Long lifetime: Provides long-term reliability and reduces maintenance costs.
• Low power consumption: Minimizes power consumption for energy-efficient designs.
• RoHS compliant: Complies with RoHS environmental regulations.

Benefits:

• Improved visibility: Enhances the visibility of displays and indicators.
• Reduced power consumption: Low power consumption helps extend battery life in portable devices.
• Simplified assembly: Surface mount package simplifies the assembly process.
• Increased reliability: Long lifetime reduces the need for frequent replacements.
• Environmental compliance: RoHS compliance ensures environmental responsibility.

Additional Details:

The QCPL-W661-560E LED typically operates at a forward voltage of around 3V and a forward current of around 20mA. The specific color and luminous intensity depend on the material composition of the LED die. Consult the Avago Technologies (Broadcom) datasheet for detailed specifications, including color coordinates, luminous intensity, and electrical characteristics.

Proper heat sinking may be required to dissipate heat generated by the LED, especially at higher drive currents. Ensure proper solder reflow profiles are followed during assembly to prevent damage to the LED. Electrostatic discharge (ESD) precautions should be observed when handling the device.