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Same model may have multiple batches, images only for reference.
XCZU9EG-3FFVB1156E Amd
Same model may have multiple batches, images only for reference.

XCZU9EG-3FFVB1156E

Part No XCZU9EG-3FFVB1156E
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 1156FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 600MHz, 1.5GHz 1156-FCBGA (35x35)
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Base Product Number XCZU9
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.31.0001
Win Source Part Number 1353763-XCZU9EG-3FFVB1156E
Ultra Librarian 3D Model Ultra Librarian XCZU9EG-3FFVB1156E CAD Model

Description

The XCZU9EG-3FFVB1156E is a high-performance system-on-chip (SoC) integrated circuit from the Zynq® UltraScale+™ MPSoC EG series by AMD.

  • Manufacturer: AMD
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Operating Temperature: 0°C to 100°C
  • Package: Tray
  • Supplier Device Package: 1156-FCBGA (35x35)
  • Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Logic Cells: 599K+
  • RAM: 256KB

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