XCZU9CG-2FFVB1156I Real Image
Same model may have multiple batches, images only for reference.

Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Base Product Number XCZU9
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.31.0001
Other Names 122-2031,XCZU9CG-2FFVB1156I-ND
Standard Package 1
Win Source Part Number 1009577-XCZU9CG-2FFVB1156I
Ultra Librarian 3D Model Ultra Librarian XCZU9CG-2FFVB1156I CAD Model

Description

The XCZU9CG-2FFVB1156I is an integrated circuit belonging to the Zynq® UltraScale+™ MPSoC CG series. Bold product name: XCZU9CG-2FFVB1156I and Bold manufacturer: [Manufacturer name missing - needs to be looked up]

  • Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5 with CoreSight™
  • Processor Speed: 533MHz and 1.3GHz
  • Package: 1156-BBGA, FCBGA
  • I/Os: 328
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • RAM Size: 256KB
  • Flash Size: None
  • Architecture: MCU and FPGA
  • FPGA Logic Cells: 599K+
  • Temperature Range: -40°C to 100°C (TJ)
  • REACH Affected: No

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