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XCZU5EV-1FBVB900I

Part No XCZU5EV-1FBVB900I
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)
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Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU5
Standard Package 1
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Win Source Part Number 1339627-XCZU5EV-1FBVB900I
Ultra Librarian 3D Model Ultra Librarian XCZU5EV-1FBVB900I CAD Model

Description

The 1339627-XCZU5EV-1FBVB900I is an embedded system on a chip (SoC) from AMD.

  • Series: Zynq UltraScale+ MPSoC EV
  • Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2
  • Speed: 500MHz, 600MHz to 1.2GHz
  • Package/Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Operating Temperature: -40 degrees Celsius to 100 degrees Celsius
  • ECCN: 5A002A4 XIL
  • Standard Package: Tray
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/O Numbers: 204
  • RAM Size: 256KB
  • Flash Size: Not applicable

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Availability: 222 pieces
Order Increment : 1 pcs
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