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XCZU3EG-1SBVA484I

Part No XCZU3EG-1SBVA484I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A53 484FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 500MHz, 600MHz, 1.2GHz 484-FCBGA (19x19)
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 484-BFBGA, FCBGA
Supplier Device Package 484-FCBGA (19x19)
Number of I/O 82
Base Product Number XCZU3
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1031929-XCZU3EG-1SBVA484I
Ultra Librarian 3D Model Ultra Librarian XCZU3EG-1SBVA484I CAD Model

Description

The Win Source Part Number 1031929-XCZU3EG-1SBVA484I is a high-performance integrated circuit that is designed to be used in various electronic applications.

  • Primary Attribute: Zynq UltraScale+ FPGA, 154K+ Logic Cells
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA and WDT
  • I/Os: 82
  • RAM Size: 256KB
  • Flash Size: -
  • Architecture: MCU, FPGA
  • Temperature Range: -40 degrees Celsius to 100 degrees Celsius (TJ)
  • MSL Level: 4 (72 hours)
  • REACH Status: REACH unaffected
  • HTSUS Code: 8542.39.0001
  • Supplier Device Package: 484-FCBGA (19x19)

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