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Same model may have multiple batches, images only for reference.
XCZU3CG-1SFVA625E Real Image
Same model may have multiple batches, images only for reference.

XCZU3CG-1SFVA625E

Part No XCZU3CG-1SFVA625E
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 625FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC CG
Package Bulk
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 625-BFBGA, FCBGA
Supplier Device Package 625-FCBGA (21x21)
Number of I/O 180
Base Product Number XCZU3
Standard Package 1 pcs
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Win Source Part Number 996134-XCZU3CG-1SFVA625E
Ultra Librarian 3D Model Ultra Librarian XCZU3CG-1SFVA625E CAD Model

Description

The XCZU3CG-1SFVA625E is a high-performance system-on-chip (SoC) integrated circuit from AMD.

  • Series: Zynq UltraScale+ MPSoC CG
  • Processor: Dual ARM Cortex-A53 MPCore with CoreSight and dual ARM Cortex-R5 with CoreSight
  • Speeds: 500MHz and 1.2GHz
  • Package: Bulk
  • Standard Package: 1 piece
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/Os: 180
  • RAM: 256KB
  • FPGA: Zynq UltraScale+ with 154K+ logic cells
  • Operating Temperature: 0°C to 100°C
  • MSL Level: 4 (72 hours)

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