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Same model may have multiple batches, images only for reference.
XCZU1CG-1SFVA625E Real Image
Same model may have multiple batches, images only for reference.

XCZU1CG-1SFVA625E

Part No XCZU1CG-1SFVA625E
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC ZUP MPSOC A53 FPGA 625BGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ 500MHz, 1.2GHz 625-FCBGA (21x21)
Sample
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ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™
Package Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Speed 500MHz, 1.2GHz
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 625-BFBGA, FCBGA
Supplier Device Package 625-FCBGA (21x21)
Standard Package 1
MSL Level 4 (72 Hours)
Win Source Part Number 1337533-XCZU1CG-1SFVA625E
Ultra Librarian 3D Model Ultra Librarian XCZU1CG-1SFVA625E CAD Model

Description

The XCZU1CG-1SFVA625E is an embedded system on chip (SoC) integrated circuit that belongs to the Integrated Circuits (ICs) category.

  • Series: Zynq UltraScale+
  • Manufacturer: AMD
  • Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight
  • Processor Speed: 500MHz and 1.2GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity and Peripherals: None
  • RAM Size: 256KB
  • Flash Size: Not Specified
  • Architecture: MPU, FPGA
  • Package/Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
  • Temperature Range: 0°C ~ 100°C (TJ)

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