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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Number of I/O 644
Base Product Number XCZU19
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1223018-XCZU19EG-2FFVB1517E
Ultra Librarian 3D Model Ultra Librarian XCZU19EG-2FFVB1517E CAD Model

Description

The Xilinx Zynq UltraScale+ MPSoC EG is an integrated circuit designed for use in embedded systems.

  • Core Processor: quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2
  • Speed: 533MHz, 600MHz, and 1.3GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/Os: 644
  • RAM Size: 256KB
  • Flash Size: None
  • Architecture: MCU, FPGA
  • Primary Attributes: Zynq UltraScale+ FPGA with 1143K+ logic cells
  • Package/Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
  • Operating Temperature: 0°C to 100°C (TJ)
  • MSL Level: 4 (72 hours)
  • HTSUS: 8542.39.0001
  • REACH: Unaffected

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