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XCKU3P-2FFVD900E

Part No XCKU3P-2FFVD900E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 304 I/O 900FCBGA / series Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Kintex® UltraScale+™
Package Tray
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 304
Voltage - Supply 0.825V ~ 0.876V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XCKU3
MSL Level 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1026498-XCKU3P-2FFVD900E
Ultra Librarian 3D Model Ultra Librarian XCKU3P-2FFVD900E CAD Model

Description

The Xilinx Kintex UltraScale+ is an integrated circuit that belongs to the embedded FPGAs family.

  • Description: High-end component with a large number of LABs/CLBs, logic elements/cells, and total RAM bits.
  • Mounting: Surface-mount device
  • Voltage Supply: 0.825V to 0.876V
  • Temperature Range: 0°C to 100°C
  • Reliability: Reliable component for various electronic devices and systems
  • Package: 900-BBGA, FCBGA
  • Performance: High-performance component with a low power consumption rate

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $375.3750 $375.3750
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Availability: 412 pieces
Order Increment : 1 pcs
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