XC7Z035-2FFG900E Real Image
Same model may have multiple batches, images only for reference.

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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 130
Base Product Number XC7Z035
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1016849-XC7Z035-2FFG900E
Ultra Librarian 3D Model Ultra Librarian XC7Z035-2FFG900E CAD Model

Description

The XC7Z035-2FFG900E is a high-performance system-on-chip (SoC) manufactured by AMD Xilinx.

  • Series: Zynq-7000
  • Processor: Dual ARM Cortex-A9 MPCore
  • Clock Speed: 800MHz
  • Package: 900-BBGA
  • Connectivity: CANbus, Ethernet, I2C, SPI, USB OTG
  • FPGA: Kintex-7
  • Logic Cells: 275K
  • MSL Level: 4 (72 hours)
  • Operating Temperature: 0°C to 100°C (TJ)

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $188.0598 $188.0598
2+ $181.7911 $363.5822
3+ $162.9851 $488.9553
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 580 pieces
Order Increment : 1 piece
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