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XC7Z030-2SBG485E

Part No XC7Z030-2SBG485E
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 800MHZ 485FCBGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 125K Logic Cells 800MHz 484-FCBGA (19x19)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 484-FBGA, FCBGA
Supplier Device Package 484-FCBGA (19x19)
Number of I/O 130
Base Product Number XC7Z030
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1231883-XC7Z030-2SBG485E
Ultra Librarian 3D Model Ultra Librarian XC7Z030-2SBG485E CAD Model

Description

The XC7Z030-2SBG485E is an integrated circuit (IC) manufactured by AMD Xilinx.

  • Series: Zynq-7000
  • Core Processor: dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Operating Speed: 800MHz
  • Package: tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA
  • I/Os: 130
  • RAM Size: 256KB
  • Architecture: MCU, FPGA with Kintex™-7 FPGA, 125K Logic Cells
  • Package/Case: 484-FBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
  • Operating Temperature Range: 0°C to 100°C (TJ)
  • ECCN: EAR99
  • REACH: unaffected
  • HTSUS: 8542.39.0001

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $138.0987 $138.0987
2+ $133.4949 $266.9898
3+ $119.6857 $359.0571
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Availability: 1,300 pieces
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