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XC7V2000T-L2FHG1761E

Part No XC7V2000T-L2FHG1761E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 850 I/O 1761FCBGA / series Field Programmable Gate Array (FPGA) IC 850 47628288 1954560 1760-BBGA, FCBGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Virtex®-7 T
Package Tray
Number of LABs/CLBs 152700
Number of Logic Elements/Cells 1954560
Total RAM Bits 47628288
Number of I/O 850
Voltage - Supply 0.97V ~ 1.03V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1761-FCBGA (45x45)
Base Product Number XC7V2000
RoHS Status RoHS non-compliant
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1025135-XC7V2000T-L2FHG1761E
Ultra Librarian 3D Model Ultra Librarian XC7V2000T-L2FHG1761E CAD Model

Description

The XC7V2000T-L2FHG1761E is a high-performance Virtex-7 FPGA from AMD (originally Xilinx). It is part of the Virtex-7 family, known for its high logic capacity, signal processing capabilities, and high-speed serial connectivity. This FPGA is designed for demanding applications that require significant processing power and data throughput.

Applications

  • High-performance computing (HPC): Used in HPC systems for accelerating computationally intensive tasks, such as simulations, data analysis, and algorithm development.
  • Data center acceleration: Deployed in data centers to accelerate workloads like machine learning inference, video transcoding, and network processing.
  • Aerospace and defense: Utilized in radar systems, signal intelligence, and image processing applications that demand high performance and reliability.
  • Wired and wireless communication infrastructure: Implements high-speed communication protocols and performs signal processing for cellular base stations and network equipment.
  • Medical imaging: Used in medical imaging systems for real-time image processing and analysis.

Features

  • 2,036,000 Logic Cells: Provides a large logic capacity for implementing complex digital circuits.
  • 1,440 Kb Block RAM: On-chip Block RAM for high-speed data storage.
  • 3600 DSP Slices: Dedicated DSP slices for accelerating signal processing algorithms.
  • High-Speed Serial Transceivers: Supports multiple high-speed serial protocols like PCIe, Ethernet, and Aurora.
  • Advanced Power Management: Features power-saving technologies to minimize power consumption.

Benefits

  • High Performance: Delivers exceptional performance for demanding applications.
  • Scalability: Enables the development of scalable systems that can adapt to evolving requirements.
  • Flexibility: Provides a flexible platform for implementing custom logic and algorithms.
  • Reduced System Cost: Can reduce system cost by integrating multiple functions into a single device.
  • Faster Time-to-Market: Allows for rapid prototyping and development of complex systems.

Additional Details

The XC7V2000T-L2FHG1761E is packaged in a 1761-pin Fine-Pitch Ball Grid Array (FBGA). It operates at a specific voltage level and has defined operating temperature ranges. The -L2 denotes a specific speed grade and voltage variant within the Virtex-7 family. Consult the AMD/Xilinx documentation for detailed specifications including power consumption, I/O count, and supported memory interfaces.

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