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XC6VSX315T-L1FFG1156I

Part No XC6VSX315T-L1FFG1156I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 600 I/O 1156FCBGA / series Field Programmable Gate Array (FPGA) IC 600 25952256 314880 1156-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Virtex®-6 SXT
Package Tray
Number of LABs/CLBs 24600
Number of Logic Elements/Cells 314880
Total RAM Bits 25952256
Number of I/O 600
Voltage - Supply 0.91V ~ 0.97V
Mounting SMD (SMT)
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Base Product Number XC6VSX315
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1032586-XC6VSX315T-L1FFG1156I
Ultra Librarian 3D Model Ultra Librarian XC6VSX315T-L1FFG1156I CAD Model

Description

The XC6VSX315T-L1FFG1156I is a Virtex-6 FPGA from AMD (formerly Xilinx). It's a high-performance FPGA designed for demanding applications requiring substantial logic resources, high-speed processing, and extensive I/O capabilities. The 'L1' typically signifies a specific speed grade and power optimization level, 'FFG1156' refers to the package type (Fine-Pitch Flip-Chip Ball Grid Array with 1156 balls), and 'I' denotes the industrial temperature range.

Applications

  • High-performance computing
  • Data centers
  • Networking infrastructure (routers, switches)
  • Telecommunications equipment
  • Aerospace and defense applications

Features

  • 315,000 logic cells: Provides a massive amount of programmable logic.
  • High-speed serial transceivers: Supports a variety of high-speed serial protocols.
  • Integrated memory controllers: Enables efficient access to external memory devices.
  • Digital Signal Processing (DSP) slices: Dedicated hardware for implementing DSP algorithms.
  • Block RAM: On-chip memory blocks for data storage.
  • Clock management: Advanced clock management capabilities for flexible clock distribution.
  • FFG1156 package: Fine-Pitch Flip-Chip Ball Grid Array with 1156 balls.
  • Industrial temperature range: Operates reliably in harsh environments.
  • Low power optimization: 'L1' speed grade indicates power-efficient design.

Benefits

  • High performance: Enables high-speed processing and complex algorithm implementation.
  • Flexibility: Allows for custom hardware acceleration and system customization.
  • Large logic capacity: Supports complex and demanding designs.
  • Robustness: Industrial temperature range ensures reliable operation in harsh environments.
  • Power efficiency: Optimized for low power consumption.

Additional Details

The XC6VSX315T-L1FFG1156I requires external configuration memory to store the configuration bitstream. It is programmed using Xilinx's ISE or Vivado development tools. The architecture consists of Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and dedicated routing resources. Detailed specifications, including timing parameters, power consumption, and pinout information, are available in the Xilinx Virtex-6 FPGA family datasheet. The device supports various configuration modes, including JTAG, SelectMAP, and Serial configuration. The 'FFG1156' package provides a high-density interconnect solution. Designs are typically created using Hardware Description Languages (HDLs) like VHDL or Verilog, and then synthesized and implemented onto the FPGA using Xilinx's software. The FPGA includes dedicated resources for implementing high-speed interfaces such as DDR3 memory controllers, PCI Express, and Gigabit Ethernet. AMD acquired Xilinx, so current documentation and support may be found under the AMD brand.

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