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ACT-F128K32N-070P7Q

Part No ACT-F128K32N-070P7Q
Manufacturer Aeroflex Metelics, Division of MACOM
Catalog Hard To Find
Description ACT-F128K32 High Speed 4 Megabit FLASH Multichip Module
Sample
Rohs State Need to verify
ECAD Module
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RoHS State Request Verification
Manufacturer Aeroflex Metelics, Division of MACOM
Win Source Part Number 1135589-ACT-F128K32N-070P7Q
Manufacturer Homepage www.aeroflex.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian ACT-F128K32N-070P7Q CAD Model

Description

The ACT-F128K32N-070P7Q is a high-performance memory module manufactured by Aeroflex Metelics, Division of MACOM. It is likely a Static Random Access Memory (SRAM) device designed for applications requiring fast access times and reliable data storage. Aeroflex Metelics specializes in high-reliability components for aerospace and defense applications.

Applications

  • Aerospace systems
  • Defense applications
  • High-performance computing
  • Data acquisition systems
  • Embedded systems requiring fast memory access

Features

  • High-speed SRAM
  • Capacity: 128K x 32 bits
  • Access time: 70ns
  • High reliability
  • Wide operating temperature range
  • Hermetically sealed package

Benefits

  • Provides fast and reliable data storage in demanding environments
  • Meets stringent requirements for aerospace and defense applications
  • Ensures data integrity under harsh conditions
  • Enables high-performance computing in embedded systems
  • Offers long-term reliability

Additional Details

The ACT-F128K32N-070P7Q is specifically designed for applications where data integrity and reliability are crucial. The '070P7Q' likely indicates specific screening levels, temperature ranges, and packaging details. Due to the nature of Aeroflex Metelics products, detailed specifications are often proprietary. It is crucial to obtain the full datasheet from the manufacturer for complete technical information. The high-speed access time allows for real-time data processing. The hermetically sealed package protects the memory from environmental factors. These modules are subjected to rigorous testing to ensure they meet the required performance and reliability standards. The device's architecture and manufacturing processes are optimized for high-radiation environments.

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