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XCV200-4BGG352C

Part No XCV200-4BGG352C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description Xilinx 352BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Number of Gates 236666
RoHS Compliant
Win Source Part Number 999619-XCV200-4BGG352C
Categories Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCV200-4BGG352C CAD Model

Description

The XCV200-4BGG352C is a Field-Programmable Gate Array (FPGA) from the Virtex series manufactured by Xilinx Inc. This FPGA is designed for high-performance digital logic applications, offering a flexible and programmable platform for implementing custom hardware functions. It features a large number of configurable logic blocks, interconnect resources, and I/O pins, allowing designers to create complex digital systems. The "-4" speed grade indicates a specific performance level, and "BGG352C" designates the package type (Ball Grid Array) and temperature range (Commercial).

Applications

  • Digital Signal Processing (DSP): Implements complex DSP algorithms for audio, video, and communication applications.
  • Image and Video Processing: Used in image and video processing systems for tasks such as encoding, decoding, and filtering.
  • Networking Equipment: Implements custom network protocols and interfaces in routers, switches, and other networking devices.
  • Industrial Automation: Controls and monitors industrial processes using custom logic and interfaces.
  • Aerospace and Defense Systems: Provides programmable logic for various aerospace and defense applications.
  • Emulation and Prototyping: Emulates ASICs or other hardware designs for verification and prototyping.

Features

  • Configurable Logic Blocks (CLBs): Provides a large number of configurable logic blocks for implementing custom logic functions.
  • Programmable Interconnect Resources: Allows for flexible routing and interconnection of logic blocks.
  • I/O Blocks (IOBs): Offers a wide range of I/O pins for interfacing with external devices.
  • Embedded Memory Blocks: Provides on-chip memory for data storage and processing.
  • Clock Management: Supports clock generation and distribution for high-speed operation.
  • Ball Grid Array (BGA) Package: Offers high pin density and efficient thermal management.

Benefits

  • Flexibility and Programmability: Allows designers to implement custom hardware functions and modify designs easily.
  • High Performance: Provides high-speed operation for demanding applications.
  • Integration: Integrates a large number of logic gates and memory blocks on a single chip.
  • Reduced Time-to-Market: Allows for rapid prototyping and development of custom hardware solutions.
  • Cost-Effectiveness: Provides a cost-effective alternative to custom ASIC designs.

Additional Details

The XCV200-4BGG352C typically operates with a supply voltage of 3.3V or 2.5V. The number of logic cells, memory capacity, and I/O count vary depending on the specific device in the Virtex series. The device is programmed using a hardware description language (HDL) such as VHDL or Verilog and Xilinx's development tools. Consult the datasheet for specific electrical characteristics, timing parameters, and package dimensions. Static timing analysis is crucial for verifying timing performance.

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