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XC7Z0352FFG676C

Part No XC7Z0352FFG676C
Manufacturer Xilinx Inc.
Catalog OEM Parts (T - Z)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1025142-XC7Z0352FFG676C
Categories OEM Parts(T-Z)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XC7Z0352FFG676C CAD Model

Description

The XC7Z035-2FFG676C is a System-on-Chip (SoC) from Xilinx, belonging to the Zynq-7000 family. This SoC integrates a dual-core ARM Cortex-A9 processor with 7 Series FPGA fabric on a single chip. This architecture enables developers to create powerful and flexible embedded systems that can handle both software and hardware processing tasks efficiently.

Applications

  • Industrial Automation: Used in industrial control systems for motor control, machine vision, and data acquisition.
  • Automotive Driver Assistance Systems (ADAS): Employed in ADAS applications for sensor fusion, image processing, and real-time control.
  • Aerospace and Defense: Deployed in avionics systems, radar processing, and communication systems.
  • Medical Imaging: Utilized in medical imaging devices for image processing and analysis.
  • Broadcast and Media: Used in video processing equipment, such as encoders, decoders, and video servers.

Features

  • Dual-Core ARM Cortex-A9 Processor: Provides processing power for running operating systems and application software.
  • 7 Series FPGA Fabric: Offers a flexible platform for implementing custom hardware accelerators and logic functions.
  • Integrated Memory Controllers: Supports DDR3 memory for high-speed data access.
  • Peripheral Interfaces: Includes a variety of peripheral interfaces, such as Ethernet, USB, UART, and SPI.
  • Advanced Security Features: Incorporates security features, such as encryption and authentication, to protect sensitive data.

Benefits

  • High Performance: Delivers high performance for both software and hardware processing tasks.
  • Flexibility: Provides a flexible platform for implementing custom hardware and software solutions.
  • Reduced System Cost: Integrates multiple functions into a single chip, reducing system cost and complexity.
  • Faster Time-to-Market: Enables rapid prototyping and development of embedded systems.
  • Power Efficiency: Optimizes power consumption for energy-sensitive applications.

Additional Details

The XC7Z035-2FFG676C is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA). The "-2" indicates the speed grade. The "FFG" signifies the package type. This SoC requires a specific power supply configuration and external components for proper operation. Detailed specifications, including memory size, I/O count, and power consumption, can be found in the Xilinx Zynq-7000 family datasheet.

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