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XC7Z030-1FBG676I Real Image XC7Z030-1FBG676I Real Image
Same model may have multiple batches, images only for reference.
XC7Z030-1FBG676I Real Image XC7Z030-1FBG676I Real Image
XC7Z030-1FBG676I Real Image XC7Z030-1FBG676I Real Image
Same model may have multiple batches, images only for reference.

XC7Z030-1FBG676I

Part No XC7Z030-1FBG676I
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Xilinx Inc.
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM Cortex -A9 MPCore with CoreSight
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex -7 FPGA, 125K Logic Cells
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Part Number Series XC7Z030
Manufacturer Pack Quantity 1
MSL Level 4 (72 Hours)
Popularity Medium
Supply and Demand Status Balance
Win Source Part Number 808182-XC7Z030-1FBG676I
Ultra Librarian 3D Model Ultra Librarian XC7Z030-1FBG676I CAD Model

Description

The XC7Z030-1FBG676I from Xilinx Inc. is a Kintex-7 FPGA with 125K Logic Cells.

  • Processor: Dual ARM Cortex-A9 MPCore with CoreSight, 667MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • RAM Size: 256KB
  • Temperature Range: -40°C to 100°C
  • Supply and Demand Status: Balanced

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1+ $102.5022 $102.5022
2+ $99.1957 $198.3914
3+ $95.8891 $287.6673
4+ $85.9696 $343.8784
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