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XC3S500E-FGG320

Part No XC3S500E-FGG320
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
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Category Integrated Circuits(ICs)
Family Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Win Source Part Number 412669-XC3S500E-FGG320
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3S500E-FGG320 CAD Model

Description

The XC3S500E-FGG320 is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. It's designed to offer a combination of low cost, high performance, and low power consumption. The 'E' designation signifies enhancements over the base Spartan-3 family, particularly in power management and feature integration.

Applications

  • Industrial control systems: Programmable logic controllers (PLCs), motor control, and sensor interfacing.
  • Consumer electronics: Digital TVs, gaming consoles, and portable media players.
  • Automotive electronics: In-vehicle infotainment, advanced driver-assistance systems (ADAS), and body control modules.
  • Communications equipment: Wireless base stations, network routers, and data acquisition systems.
  • Medical devices: Diagnostic imaging, patient monitoring, and medical instrumentation.

Features

  • Enhanced system-level features: Integrated DLLs, RAM blocks, and multipliers for complex system design.
  • Abundant on-chip memory: Substantial block RAM resources for efficient data storage and manipulation.
  • Digital Clock Manager (DCM): Advanced clock management for frequency synthesis, clock de-skew, and jitter reduction.
  • Flexible I/O standards: Supports a wide range of I/O standards for seamless integration with various peripherals.
  • Fine-grained clock gating: Optimized for low-power operation, extending battery life in portable applications.
  • Advanced packaging: Offered in a FGG320 package for optimized board-level assembly and thermal management.

Benefits

  • Cost-optimized solution: Provides a cost-effective platform for a wide array of applications.
  • High performance and low power: Balances performance and power efficiency for demanding applications.
  • Design flexibility: Facilitates customization and adaptation to specific application requirements.
  • Reduced development time: Accelerates design cycles with comprehensive development tools and IP cores.
  • Improved system integration: Simplifies system design by integrating multiple functions onto a single chip.

Additional Details

The XC3S500E-FGG320 is fabricated using a 90nm process technology. It features 500,000 system gates, providing significant resources for implementing complex logic designs. The architecture includes distributed RAM, block RAM, and dedicated multipliers to enhance computational performance. The device also incorporates advanced clock management capabilities, including frequency synthesis and clock de-skewing. The configurable I/Os support a variety of industry-standard interfaces. It's suitable for applications requiring a balance of performance, low power consumption, and cost-effectiveness. The FGG320 package offers good thermal performance and facilitates efficient board-level assembly.

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