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XC3S12E4FGG320I

Part No XC3S12E4FGG320I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
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Category Integrated Circuits(ICs)
Family Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Win Source Part Number 412649-XC3S12E4FGG320I
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3S12E4FGG320I CAD Model

Description

The XC3S12E4FGG320I is a member of the Spartan-3E family of Field-Programmable Gate Arrays (FPGAs) from Xilinx. It is designed to provide a cost-optimized solution for a wide array of digital logic applications. This FPGA offers a balance of performance, power efficiency, and flexibility, making it suitable for embedded systems, industrial control, and consumer electronics.

Applications

  • Motor Control: Used for precise control of motors in industrial and robotics applications.
  • Industrial Automation: Employed in programmable logic controllers (PLCs) and other automation equipment.
  • Embedded Computing: Integrated into embedded systems for real-time data processing and control.
  • Security Systems: Utilized in surveillance systems, access control, and intrusion detection systems.
  • Medical Instrumentation: Applied in diagnostic equipment and patient monitoring systems.

Features

  • Logic Cells: Contains 11,664 logic cells, allowing for the implementation of moderately complex digital designs.
  • Distributed RAM: Features 504 Kbits of distributed RAM for on-chip data storage.
  • Block RAM: Includes 504 Kbits of block RAM for larger memory requirements.
  • Multipliers: Equipped with 26 dedicated 18 x 18 multipliers for high-speed arithmetic operations.
  • Digital Clock Managers (DCMs): Provides advanced clock management and frequency synthesis.
  • I/O Pins: Offers 232 user I/O pins for interfacing with external devices and systems.
  • Package: Available in a 320-pin Fine-Pitch Ball Grid Array (FGG320) package.
  • Operating Temperature: Industrial temperature range (-40°C to +100°C).

Benefits

  • Cost Optimization: Offers a cost-effective solution for digital logic implementation.
  • High Performance: Delivers high-speed processing capabilities for demanding applications.
  • Flexibility: Allows for custom hardware implementation and design modifications.
  • Integration: Integrates multiple functions into a single chip, reducing board space and system complexity.
  • Reconfigurability: Enables in-system reprogramming, allowing for design updates and feature enhancements without hardware changes.

Additional Details

The XC3S12E4FGG320I operates at a voltage range of 1.14V to 1.26V. It is supported by Xilinx's ISE design suite, which provides comprehensive tools for design entry, simulation, and implementation. The device's architecture includes Configurable Logic Blocks (CLBs), which are the fundamental building blocks for implementing logic functions. The Spartan-3E family is known for its low static power consumption, making it suitable for battery-powered and energy-sensitive applications. The FGG320 package ensures a compact footprint and efficient thermal management. The inclusion of multiple DCMs facilitates complex clocking schemes, essential for high-speed digital designs.

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