The Xilinx XC1736DVC is a high-density, in-system programmable Read-Only Memory (PROM) configuration device used to store configuration data for Xilinx Field-Programmable Gate Arrays (FPGAs). Upon power-up, this PROM ensures a fast and dependable FPGA configuration, enabling immediate system functionality. The 'DVC' likely refers to a specific package type and operating voltage.

Applications

• Configuration memory for Xilinx FPGAs in networking devices.
• Boot ROM for embedded systems in various industrial applications.
• Program storage in control systems that require reliable start-up procedures.
• Use in military and defense applications requiring rugged components.
• Automotive applications where quick system configuration is essential.

Features

• In-System Programmable: Facilitates easy reprogramming without the need for device removal.
• High Density: Provides 36k bits of memory for complex FPGA setups.
• Fast Configuration: Enables speedy FPGA configuration during power-up.
• Non-Volatile Storage: Maintains data integrity even when power is off.
• High Endurance: Capable of withstanding many programming cycles.

Benefits

• Simplified FPGA Configuration: Offers a streamlined approach for configuring Xilinx FPGAs.
• Faster Development Cycles: In-system programmability allows for swift debugging and design modifications.
• Reliable System Startup: Guarantees correct FPGA configuration each time the system is powered on.
• Cost-Effective: Reduces reliance on external memory components.
• Design Flexibility: Supports diverse FPGA configuration setups.
• Improved System Performance: Fast configuration times minimize system boot delays.

Additional Details

The XC1736DVC interfaces with the FPGA via a serial configuration interface, loading configuration data upon power-up. It is typically programmed using a Xilinx programmer and software tools. Refer to the Xilinx datasheet for precise specifications, including timing diagrams, voltage requirements, and programming guidelines, to ensure proper operation and long-term reliability. The package type is likely a versatile SOIC or PLCC option.