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XA3S400-4FGG456I

Part No XA3S400-4FGG456I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 264 I/O 456FBGA
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 264 294912 8064 456-BBGA
Manufacturer Xilinx Inc.
Series Automotive, AEC-Q100, Spartan®-3 XA
Package Tray
Number of I/O 264
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 456-BBGA
Case / Package 456-FBGA (23x23)
Family Name XA3S400
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 1
Popularity High
Supply and Demand Status Balance
Win Source Part Number 903510-XA3S400-4FGG456I
Ultra Librarian 3D Model Ultra Librarian XA3S400-4FGG456I CAD Model

Description

The XA3S400-4FGG456I is a member of the Spartan-3A family of Field Programmable Gate Arrays (FPGAs) from Xilinx. This FPGA offers a balance of low cost, low power consumption, and high performance, making it suitable for a wide range of applications.

Applications:

  • Industrial control and automation
  • Automotive infotainment and driver assistance systems
  • Consumer electronics (e.g., digital cameras, portable media players)
  • Networking and communications equipment
  • Embedded systems
  • Image and video processing

Features:

  • 400,000 System Gates: Provides a substantial amount of logic resources for implementing complex digital circuits.
  • High Performance: Delivers high-speed performance for demanding applications.
  • Low Power Consumption: Designed for low-power operation, extending battery life in portable devices.
  • Flexible Architecture: Offers a flexible architecture that can be customized to meet specific application requirements.
  • Advanced Feature Set: Includes a rich set of features, such as embedded multipliers, digital clock managers (DCMs), and distributed RAM.
  • Fine-Grained Architecture: Provides a fine-grained architecture that allows for efficient resource utilization.

Benefits:

  • Flexibility and Customization: Allows designers to implement custom logic circuits tailored to their specific needs.
  • High Performance: Enables high-speed processing and data throughput.
  • Low Power Consumption: Reduces power consumption, making it suitable for portable and battery-powered applications.
  • Cost-Effective Solution: Provides a cost-effective solution for implementing complex digital designs.
  • Rapid Prototyping: Facilitates rapid prototyping and development of digital systems.

Additional Details:

The XA3S400-4FGG456I is packaged in a 456-pin Fine-Pitch Ball Grid Array (FGG) package. It operates with a core voltage of 1.2V. The device includes embedded multipliers for high-speed arithmetic operations, DCMs for clock management, and distributed RAM for on-chip memory storage. The Spartan-3A family supports a variety of I/O standards. For detailed specifications, including pinout diagrams, timing characteristics, and power consumption data, please refer to the Xilinx datasheet and associated documentation.

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