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W971GG6PB-25

Part No W971GG6PB-25
Manufacturer Winbond Electronics
Catalog Unclassified Memory
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ECAD Module
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Category Integrated Circuits(ICs)
Family Memory
Manufacturer Winbond Electronics
Win Source Part Number 410458-W971GG6PB-25
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian W971GG6PB-25 CAD Model

Description

The Winbond W971GG6PB-25 is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component. Manufactured by Winbond Electronics, it is engineered for high-performance applications requiring fast and efficient memory access. It is a memory solution that balances speed, capacity, and power efficiency.

Applications

  • Desktop PCs
  • Laptops
  • Servers
  • Networking equipment
  • Embedded systems

Features

  • DDR3 Technology: Utilizes DDR3 architecture, providing significantly improved bandwidth and reduced power consumption compared to DDR2.
  • High-Speed Data Transfer: Enables high data transfer rates for fast memory access.
  • Low Power Consumption: Designed for low power consumption, making it suitable for energy-efficient systems.
  • 8-bit Prefetch Buffer: Employs an 8-bit prefetch buffer to enhance memory access efficiency.
  • On-Die Termination (ODT): Features on-die termination to improve signal integrity and reduce signal reflections.
  • JEDEC Standard Compliance: Complies with JEDEC standards, ensuring compatibility with a wide range of systems.

Benefits

  • Enhanced System Performance: Improves overall system performance by enabling faster data access and processing.
  • Reduced Power Consumption: Minimizes power consumption, contributing to longer battery life and lower energy costs.
  • Improved Signal Integrity: Ensures reliable data transfer with reduced signal reflections and noise.
  • Simplified System Design: Complies with JEDEC standards, simplifying system integration and ensuring compatibility.

Additional Details

The W971GG6PB-25 is designed to operate within a specific voltage range, adhering to the DDR3 standard, which optimizes both performance and power consumption. Its operating temperature limits are detailed in its product datasheet. Its memory capacity will vary depending on its particular configuration. It is often used in systems needing high-speed memory and minimal latency. Different packaging options may be provided based on application needs. Detailed technical specifications, including timing parameters, voltage levels, and operating modes, can be found in the product datasheet.

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