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WR08X4703FGL

Part No WR08X4703FGL
Manufacturer Walsin Technology Corporation
Catalog Misc Products
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Manufacturer Walsin Technology Corporation
Popularity Low
Supply and Demand Status Balance
Win Source Part Number 842490-WR08X4703FGL
Ultra Librarian 3D Model Ultra Librarian WR08X4703FGL CAD Model

Description

The WR08X4703FGL is a thick film chip resistor manufactured by Walsin Technology Corporation. This resistor is designed for various general purpose electronic applications and provides stable resistance within specific tolerance ranges. It is commonly used in circuits requiring precise resistance values and reliable operation.

Applications

  • Current sensing in power supplies
  • Feedback resistors in instrumentation amplifiers
  • Voltage dividers in analog-to-digital converters (ADCs)
  • Termination resistors in high-speed data lines
  • General-purpose resistance in signal conditioning circuits

Features

  • Compact Size: 0805 package (2.0 mm × 1.25 mm) provides a small footprint.
  • Thick Film Technology: Ensures stable resistance and high reliability.
  • Tight Tolerance: Offers a tolerance of ±1%, allowing for precise circuit performance.
  • RoHS Compliant: Meets RoHS requirements for environmental protection.
  • Excellent Solderability: Designed for easy and reliable surface mount assembly.

Benefits

  • Precise Circuit Performance: Tight tolerance ensures accurate resistance values.
  • Stable Operation: Thick film technology provides consistent performance over time.
  • Reduced Board Space: Small package size allows for high-density PCB layouts.
  • Environmentally Friendly: RoHS compliance reduces environmental impact.
  • Easy Assembly: Compatible with automated surface mount assembly equipment.

Technical Specifications

The WR08X4703FGL has a resistance value of 470k ohms with a tolerance of ±1%. The power rating is 0.125W (1/8W), and the maximum operating voltage is around 75V. The temperature coefficient of resistance (TCR) is typically ±100 ppm/°C. It is constructed using a ceramic substrate with a thick film resistive element and protective coating. The termination is achieved through solder-plated pads, making it suitable for surface mount applications.

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