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TFDU4100-TT3

Part No TFDU4100-TT3
Manufacturer Vishay
Catalog IrDA Transceiver Modules
Description Serial Infrared Transceiver SIR, 115.2 kbit/s, 2.7 V to 5.5 V Operation
Sample
Rohs State rohs
ECAD Module
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Category Sensors,Transducers
Family IrDA Transceiver Modules
Manufacturer Vishay
Win Source Part Number 216827-TFDU4100-TT3
Popularity Medium
Supply and Demand Status Limited
Application Field Used in Consumer Electronics, Medical, Industrial
Ultra Librarian 3D Model Ultra Librarian TFDU4100-TT3 CAD Model

Description

The TFDU4100-TT3 is an infrared (IR) transceiver module produced by Vishay Semiconductors. It is designed for short-range wireless data communication applications, adhering to the IrDA physical layer standard. This module integrates an infrared emitter (IRED), a photodiode, and control circuitry into a single compact package, facilitating easy implementation of IrDA communication in various devices.

Applications:

  • IrDA communication in mobile devices (smartphones, PDAs)
  • Data transfer in laptop computers and notebooks
  • Wireless communication with printers and digital cameras
  • Medical devices requiring wireless data exchange
  • Industrial control equipment

Features:

  • Compliant with IrDA physical layer specification
  • Supports data rates up to 115.2 kbit/s
  • Low power consumption for extended battery life
  • Surface-mount technology (SMT) package
  • Integrated IRED and photodiode for simplified design
  • RoHS compliant

Benefits:

  • Enables seamless wireless data transfer between IrDA-compatible devices
  • Easy integration into compact electronic devices
  • Prolongs battery life in portable applications
  • Reduces board space and component count
  • Provides reliable and standardized IR communication

The TFDU4100-TT3 transceiver module is designed to operate at standard IrDA data rates, ensuring compatibility with a wide range of devices. Its low power consumption makes it particularly well-suited for battery-powered applications, such as mobile phones and portable devices. The surface-mount package allows for efficient and automated assembly on printed circuit boards, reducing manufacturing costs. The integrated components simplify the design process and minimize the need for external circuitry.

Technical Specifications:

  • Data Rate: Up to 115.2 kbit/s
  • Wavelength: 875 nm
  • Supply Voltage: 2.4 V to 3.6 V
  • Operating Temperature: -25 °C to +85 °C
  • Package: SMD
  • IrDA Physical Layer Compliance

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