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TD62300P

Part No TD62300P
Manufacturer Toshiba Semiconductor and Storage
Catalog Interface - Drivers, Receivers, Transceivers
Description 2CH LOW VCC SINK DRIVER
Sample
Rohs State Need to verify
ECAD Module
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Category Integrated Circuits(ICs)
Family Interface - Drivers,Receivers,Transceivers
Manufacturer Toshiba Semiconductor and Storage
Win Source Part Number 215694-TD62300P
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian TD62300P CAD Model

Description

The TD62300P is a 8-channel source driver manufactured by Toshiba Semiconductor and Storage. It's designed to interface low-level logic signals with higher-voltage loads, specifically by providing a positive voltage source. It is often used to drive displays and other devices that require a controlled current source.

Applications

  • LED displays (common anode)
  • VFD (Vacuum Fluorescent Display) drivers
  • Plasma displays
  • Relay and solenoid driving (when a sourcing driver is required)
  • Level shifting

Features

  • 8-channel output
  • High output voltage (Consult datasheet for exact voltage; typically up to 80V)
  • Output current capabilities (Consult datasheet for the specific current per channel, often in the milliamp range)
  • TTL and CMOS compatible inputs
  • Built-in shift register for serial data input
  • Output Enable (OE) control
  • DIP (Dual In-line Package) package

Benefits

  • Simplified interface between logic and high-voltage/current loads
  • Reduced component count due to integrated design
  • Easy serial control minimizes microcontroller I/O pins
  • Flexible output control via Output Enable pin

Additional Details

The TD62300P includes an internal shift register, allowing for serial input of data to control the 8 output channels. This significantly reduces the number of I/O pins required from a microcontroller or other control logic. The Output Enable (OE) pin provides a global on/off control for all outputs. It is essential to consult the device datasheet for specific voltage and current limitations to ensure safe and proper operation. Consider thermal management depending on the load and operating conditions. Unlike the surface mount options, the DIP package allows for easy prototyping and breadboarding. It is important to use proper ESD precautions when handling this and other integrated circuits. Check the datasheet for specific timing requirements for the serial input and OE signals.

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