The TC74HC07AF is a high-speed CMOS logic hex buffer/driver with open drain outputs from Toshiba's TC74HC series. This device utilizes silicon gate CMOS technology to achieve high-speed operation similar to equivalent bipolar Schottky TTL devices, while maintaining the low power consumption characteristic of CMOS integrated circuits. The open-drain output allows for flexible voltage level translation and wired-OR configurations.

Applications

• General purpose logic buffering
• Level shifting applications
• Wired-OR logic implementation
• Line driving
• Memory interface
• Opto-isolator driver circuits

Features

• High-speed operation: tpd = 14ns (typ.) at VCC = 5V
• Low power dissipation: ICC = 1μA (max.) at Ta = 25°C
• High noise immunity: VNIH = VNIL = 28 % VCC (min.)
• Open-drain outputs for flexible voltage translation
• Wide operating voltage range: VCC = 2V to 6V
• Pin and function compatible with 74LS07

Benefits

• Fast signal propagation ensures minimal delay in critical paths.
• Low power consumption allows for energy-efficient designs.
• Excellent noise immunity contributes to stable operation in noisy environments.
• Open-drain outputs enable simple voltage level shifting.
• Wired-OR capability facilitates the implementation of complex logic functions.
• Wide operating voltage range offers design flexibility.

Additional Details

The TC74HC07AF comes in a SOP14 (Small Outline Package) and operates over a wide temperature range. The open-drain output configuration requires an external pull-up resistor for proper operation. The value of the pull-up resistor depends on the application and the desired speed. This buffer is designed to drive moderate capacitive loads. Due to the open-drain configuration, it can be used to interface with systems operating at different voltage levels, making it very flexible for system integration. The device provides high noise immunity, ensuring reliable operation in noisy environments. The wide operating voltage range provides flexibility in various applications and power supply configurations. The low power consumption allows for dense packaging and reduces heat dissipation, making it suitable for compact devices.