The Toshiba Semiconductor and Storage 23986 is a 128MB memory module with a 16Mx8 configuration and an 8C timing specification. This module provides temporary data storage for various electronic systems, typically in embedded applications or older computing devices.
Applications:
- Embedded Systems: Utilized in industrial control systems, instrumentation, and other embedded applications.
- Networking Devices: Employed in routers, switches, and network appliances as buffer memory.
- Legacy Equipment: Used in older computing systems and devices requiring memory upgrades or replacements.
- Industrial PCs: Provides memory for industrial computers and automation systems.
- Test and Measurement Equipment: Employed in oscilloscopes, logic analyzers, and other testing devices.
Features:
- 128MB Capacity: Offers a modest amount of memory for basic data storage.
- 16Mx8 Configuration: Organizes the memory into 16 million words, each 8 bits wide.
- 8C Timing: Specifies the CAS Latency (Column Address Strobe latency) rating.
- Standard Module Format: Adheres to a standard module form factor for compatibility.
- Fast Data Transfer: Supports relatively fast data access and transfer rates.
Benefits:
- Improved System Performance: Enhances the speed and responsiveness of compatible systems.
- Enhanced Multitasking: Allows multiple applications to run concurrently.
- Increased Data Throughput: Enables faster data processing and transfer rates.
- Cost-Effective Memory Solution: Provides a balance of performance and affordability.
- Easy Integration: Designed for straightforward installation into compatible systems.
Additional Details:
The memory module likely utilizes SDRAM (Synchronous Dynamic Random-Access Memory) technology. Given its capacity and manufacturer, it's less likely to be a DDR variant. The 16Mx8 configuration indicates the memory's organization. The 8C timing represents the CAS Latency (CL). Understanding and adhering to the module's voltage and frequency requirements is crucial for ensuring proper operation. Always consult the device datasheet before installation to confirm these specifications. Proper handling procedures, including electrostatic discharge (ESD) precautions, should be followed during installation.