The VLS2012ET-3R3N is a wire wound chip inductor manufactured by TDK Corporation. This inductor is designed for use in power supply circuits, RF circuits, and other applications requiring a small size and high performance.

Applications

• DC-DC Converters: Used in step-up (boost), step-down (buck), and other DC-DC converter topologies.
• RF Circuits: Tuning, matching, and filtering in RF circuits.
• Power Supplies: Filtering and energy storage in power supplies for various electronic devices.
• Mobile Communication Devices: Used in smartphones and other mobile devices.
• Audio Circuits: Used for filtering and impedance matching in audio circuits.

Features

• Wire Wound Construction: Provides high Q and low DCR.
• Compact Size: Allows for use in space-constrained applications.
• High Current Capacity: Can handle significant DC current without saturation.
• Low DC Resistance (DCR): Minimizes power loss due to resistance.
• Surface Mount Package: Enables automated assembly and reduces board space.

Benefits

• High Efficiency: Low DCR reduces power loss, leading to higher efficiency in power conversion.
• Improved Signal Quality: High Q improves signal filtering and impedance matching in RF circuits.
• Reliable Operation: High current capacity and robust construction ensure reliable performance.
• Compact Design: Small size enables integration into space-constrained applications.
• Stable Inductance: Maintains stable inductance over a wide range of temperatures and currents.

Additional Details

The VLS2012ET-3R3N has an inductance of 3.3µH and a rated current that varies depending on the specific part number and a DC resistance of 0.14 Ohms. It is available in a 2012 (2.0 x 1.2 mm) package. Wire-wound inductors typically offer higher Q-factors than multilayer inductors. The 'N' probably indicates the tolerance or a specific packing format.