The LMN08DPA101K is a multilayer ceramic chip inductor manufactured by Taiyo Yuden. These inductors are designed for high-frequency applications, offering excellent performance in a small form factor. They are particularly well-suited for use in mobile communication devices and other compact electronic circuits.

Applications

• Mobile phones
• Wireless LAN devices
• Bluetooth modules
• High-frequency circuits
• Matching networks

Features

• Multilayer ceramic construction
• High Q factor
• Small size (0805 case size)
• Excellent self-resonant frequency (SRF)
• Tight inductance tolerance

Benefits

• Efficient performance in high-frequency circuits due to the high Q factor, minimizing energy loss.
• Compact design due to the small size, allowing for high-density board layouts.
• Stable performance at high frequencies due to the excellent SRF, preventing unwanted resonances.
• Accurate inductance value due to the tight tolerance, ensuring consistent circuit performance.
• Reliable operation due to the robust multilayer ceramic construction.

The LMN08DPA101K features an inductance value of 100nH with a tolerance of ±10%. Its high Q factor ensures minimal energy loss in high-frequency circuits, while its compact 0805 case size allows for efficient use of board space. The excellent SRF ensures stable performance at high frequencies, and the tight inductance tolerance ensures consistent circuit performance across different devices. This inductor is designed for reflow soldering and is RoHS compliant.

This chip inductor is an excellent choice for high-frequency applications where small size and high performance are critical. Its robust construction and excellent electrical characteristics make it suitable for a wide range of wireless communication and electronic devices.