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M74HCT74M1TR

Part No M74HCT74M1TR
Manufacturer STMicroelectronics
Catalog Logic - Flip Flops
Sample
Rohs State Need to verify
ECAD Module
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Category Integrated Circuits(ICs)
Family Logic - Flip Flops
Manufacturer STMicroelectronics
Win Source Part Number 308995-M74HCT74M1TR
Popularity Low
Supply and Demand Status Sufficient
Ultra Librarian 3D Model Ultra Librarian M74HCT74M1TR CAD Model

Description

The M74HCT74M1TR from STMicroelectronics is a high-speed CMOS Dual D-type Flip Flop with clear and preset functionality. This integrated circuit is designed to be a part of the HCT (High-speed CMOS, TTL compatible) family, which ensures high-speed operation while maintaining the CMOS low power dissipation.

Key Features

  • Logic Type: Dual D-type Flip Flop
  • Supply Voltage Range: 4.5V to 5.5V
  • Output Current: -8mA / 8mA
  • Trigger Type: Positive-edge
  • Propagation Delay Time: 13ns at 4.5V
  • Operating Temperature Range: -55°C to 125°C
  • Package / Case: SO-14

The device features two independent D-type flip-flops with individual clear and set inputs. The outputs are buffered for best system performance. The information on the data input is transferred to the outputs on the positive edge of the clock pulse. Clear and set functions are independent of the clock and are initiated by a low level at the clear or set input respectively.

Applications

The M74HCT74M1TR is suitable for a wide range of applications where dual edge-triggered D-type storage is required. Common applications include:

  • Counters and dividers
  • Registers
  • Control circuits
  • Toggle circuits

Its high noise immunity and low power consumption make it ideal for use in battery-powered devices and other power-sensitive applications. The device's compatibility with TTL levels also allows it to be used in systems that integrate both CMOS and TTL technologies.

Quality and Reliability

STMicroelectronics is known for its commitment to quality and reliability. The M74HCT74M1TR is no exception, being manufactured to the highest standards to ensure consistent performance and longevity. The device is supplied in a surface-mount package, suitable for automated assembly processes and available in tape and reel packaging for efficient handling and manufacturing.

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