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S98GL016A40FQ002

Part No S98GL016A40FQ002
Manufacturer Spansion
Catalog Unclassified Memory
Sample
Rohs State rohs
ECAD Module
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Manufacturer Spansion
Category Integrated Circuits(ICs)
Family Memory
Win Source Part Number 187403-S98GL016A40FQ002
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian S98GL016A40FQ002 CAD Model

Description

The S98GL016A40FQ002 is a 16 Mbit NOR flash memory device manufactured by Spansion. It is designed for embedded applications requiring non-volatile memory for code and data storage.

Applications:

  • Automotive applications (ECUs, dashboards)
  • Industrial control systems
  • Networking devices (routers, switches)
  • Consumer electronics (set-top boxes, printers)
  • Medical devices

Features:

  • 16 Mbit (2M x 8) organization
  • NOR flash technology
  • 40ns access time
  • 3.0V single power supply
  • Sector Erase Architecture
  • Hardware Reset Pin
  • Common Flash Interface (CFI) for device identification
  • 48-pin TSOP package
  • -40°C to +85°C operating temperature range

Benefits:

  • Fast Read Performance: 40ns access time enables quick code execution and data retrieval.
  • Reliable Non-Volatile Storage: NOR flash technology ensures data retention without power.
  • Low Power Consumption: Suitable for battery-powered devices and energy-conscious applications.
  • Flexible Sector Erase: Allows for selective erasure of memory blocks.
  • Easy System Integration: CFI simplifies device identification and software development.
  • Robust Design: Wide operating temperature range for reliable operation in harsh environments.

Additional Details:

The S98GL016A40FQ002 utilizes a NOR flash memory array that allows for direct execution of code stored in the flash memory. This is crucial for embedded systems where performance is paramount. The sector erase architecture offers flexibility in managing memory. The hardware reset pin allows for external reset capabilities, improving system reliability. The TSOP package is industry-standard for ease of assembly. The device is qualified for demanding applications in automotive and industrial markets where robust performance and long product life cycles are necessary. This chip is designed to withstand high temperatures and vibrations in automotive applications.

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