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ESQT-113-02-S-D-524

Part No ESQT-113-02-S-D-524
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Description CONN SOCKET 26POS 0.079 GOLD PCB / 26 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Sample
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ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr Samtec Inc.
Series ESQT
Package Bulk
Connector Type Elevated Socket
Contact Type Forked
Style Board to Board or Cable
Number of Positions 26
Number of Positions Loaded All
Pitch - Mating 0.079" (2.00mm)
Number of Rows 2
Row Spacing - Mating 0.079" (2.00mm)
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Insulation Color Black
Insulation Height 0.524" (13.30mm)
Contact Length - Post 0.326" (8.28mm)
Temperature Range - Operating -55°C ~ 125°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Current Rating (Amps) 4.5A per Contact
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Base Product Number ESQT-113
MSL Level Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
Win Source Part Number 1037450-ESQT-113-02-S-D-524
Ultra Librarian 3D Model Ultra Librarian ESQT-113-02-S-D-524 CAD Model

Description

The ESQT-113-02-S-D-524 electronic component is a rectangular connector manufactured by Samtec Inc. It is a part of the ESQT series and has 26 positions.

  • Series: ESQT
  • Positions: 26
  • Connector Type: Elevated Socket
  • Contact Type: Forked
  • Positions Loaded: All
  • Rows: Two
  • Termination: Solder
  • Fastening Type: Push-Pull
  • Contact Material: Phosphor Bronze
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Insulation Color: Black
  • Contact Finish (Mating): Gold with a thickness of 30.0µin (0.76µm)
  • Contact Finish (Post): Tin
  • Application: Board to Board or Cable

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