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K4T1G044GF-BCE6

Part No K4T1G044GF-BCE6
Manufacturer Samsung
Catalog DDR
Description DDR2-667 256Mx4 (1Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942030-K4T1G044GF-BCE6
Series *
Ultra Librarian 3D Model Ultra Librarian K4T1G044GF-BCE6 CAD Model

Description

The K4T1G044GF-BCE6 is a 1Gb DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) chip manufactured by Samsung. It's designed for applications requiring high memory bandwidth and low latency, such as graphics cards, high-performance computing, and embedded systems.

Applications:

  • Graphics cards
  • High-performance computing
  • Embedded systems
  • Gaming consoles
  • Networking devices
  • Digital TVs

Features:

  • 1Gb (128M x 8) memory organization
  • DDR2 interface: Double data rate operation for high bandwidth
  • Data transfer rates up to 800 Mbps
  • Operating voltage: 1.8V
  • 8 internal banks for concurrent operation
  • Write latency of 0 or 1 clock cycles
  • 8n prefetch architecture
  • On-Die Termination (ODT)
  • Lead-free and RoHS compliant

Benefits:

  • High memory bandwidth for demanding applications
  • Low operating voltage for reduced power consumption
  • Improved system performance with 8 internal banks
  • Simplified system design with ODT
  • Environmentally friendly with lead-free and RoHS compliance

Additional Details:

The K4T1G044GF-BCE6 is a key component in DDR2 memory modules. The 8 internal banks allow for concurrent operation, increasing memory throughput. The On-Die Termination (ODT) feature reduces signal reflections and improves signal integrity, particularly at high data rates. The chip operates at 1.8V, which reduces power consumption and heat dissipation. It uses a 8n prefetch architecture to enable high speed data access.

The part is designed to meet the stringent requirements of high-performance applications. The operating temperature range is specified to meet the needs of various applications. It is available in a FBGA (Fine-Pitch Ball Grid Array) package for ease of surface mounting on PCBs.

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