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K4H560838D-TCB3

Part No K4H560838D-TCB3
Manufacturer Samsung
Catalog DDR
Description DDR-333 32Mx8
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 944189-K4H560838D-TCB3
Series *
Ultra Librarian 3D Model Ultra Librarian K4H560838D-TCB3 CAD Model

Description

The K4H560838D-TCB3 is a 512Mb DDR (Double Data Rate) SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Samsung. This memory component is designed to provide high-speed data access for a variety of applications, including graphics cards, computer systems, and embedded devices. The DDR technology allows for data transfer on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate compared to traditional SDRAM.

Applications:

  • Graphics Cards: Used as main memory in graphics cards for storing textures, frame buffers, and other graphical data.
  • Computer Systems: Employed in desktop and laptop computers as system memory.
  • Embedded Systems: Integrated into embedded systems requiring high-speed memory access.
  • Gaming Consoles: Utilized in gaming consoles for storing game data and textures.
  • Networking Equipment: Used in routers, switches, and other networking devices for packet buffering.

Features:

  • 512Mb Capacity: Provides a storage capacity of 512 megabits.
  • DDR Technology: Supports double data rate for high-speed data transfer.
  • Data Rate: Specified data transfer rate (e.g., DDR400, DDR333, DDR266) depending on the exact variant.
  • Clock Frequency: Operates at a specific clock frequency.
  • Operating Voltage: Requires a specific operating voltage, typically 2.5V or 1.8V.

Benefits:

  • High-Speed Data Access: DDR technology enables fast data transfer rates for improved performance.
  • Large Storage Capacity: 512Mb capacity provides ample storage for various applications.
  • Efficient Memory Management: Allows for efficient memory management in complex systems.
  • Reliable Performance: Designed for reliable and consistent performance in demanding environments.
  • Wide Compatibility: Compatible with a wide range of systems and applications.

Additional Details:

The K4H560838D-TCB3 typically comes in a FBGA (Fine-Pitch Ball Grid Array) package. It supports various JEDEC standards for DDR memory. The specific data rate and timings of the memory chip are critical for system performance and must be considered during system design. The chip requires proper termination and decoupling to ensure signal integrity and stable operation. This memory device is commonly used in applications where high bandwidth and low latency are essential for optimal performance. Detailed specifications can be found in the official Samsung datasheet for this part number.

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Pricing & Ordering

Quantity Unit Price Ext. Price
6+ $9.6565 $57.9390
15+ $7.9233 $118.8495
23+ $7.6758 $176.5434
32+ $7.4282 $237.7024
41+ $7.1806 $294.4046
54+ $6.4377 $347.6358
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Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 1,025 pieces
MOQ: 6 pcs
Order Increment : 1 pcs
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