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RLZ3.6B

Part No RLZ3.6B
Manufacturer Rohm Semiconductor
Catalog Diodes - Zener - Single
Description Zener diode
Sample
Rohs State rohs
ECAD Module
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Manufacturer Rohm Semiconductor
Category Discrete Semiconductor Products
Family Diodes - Zener - Single
Win Source Part Number 183400-RLZ3.6B
Popularity Medium
Supply and Demand Status Sufficient
Ultra Librarian 3D Model Ultra Librarian RLZ3.6B CAD Model

Description

The RLZ3.6B is a Zener diode manufactured by Rohm Semiconductor. It is designed to maintain a stable voltage level, providing voltage regulation and surge protection for various electronic applications. Its compact design and robust characteristics contribute to circuit stability and efficiency.

Applications

  • Voltage stabilization in electronic circuits
  • Overvoltage protection for sensitive components
  • Voltage clipping in signal processing circuits
  • Reference voltage source for power supplies
  • Transient voltage suppression

Features

  • Zener Voltage: 3.6V
  • High surge current withstanding capability
  • Small outline package (SOD) for space-saving designs
  • High reliability and stable performance
  • Lead-free finish, RoHS compliant

Benefits

  • Provides stable voltage regulation, enhancing circuit performance.
  • Protects electronic components from voltage spikes, increasing longevity.
  • Suitable for compact designs due to small package size.
  • Ensures reliable operation in various environmental conditions.
  • Environmentally friendly due to lead-free construction.

Additional Details

The RLZ3.6B Zener diode is commonly available in a surface mount package (SOD). Key electrical characteristics include a Zener voltage (Vz) of 3.6V, reverse leakage current (Ir) at a specific voltage, and power dissipation. Precise values for these parameters are found in the datasheet and can vary with temperature. The surge current capability is a critical parameter for applications requiring overvoltage protection. Designers must also consider the operating temperature range to ensure optimal device performance and reliability. Proper PCB layout and heat sinking techniques may be required depending on the power dissipation requirements of the specific application.

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