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MMSTA63T146

Part No MMSTA63T146
Manufacturer Rohm Semiconductor
Catalog OEM Parts (M - N)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1079573-MMSTA63T146
Categories OEM Parts(M-N)
Manufacturer Rohm Semiconductor
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian MMSTA63T146 CAD Model

Description

The Rohm Semiconductor MMSTA63T146 is a PNP bipolar junction transistor (BJT) designed for switching and amplification applications. It is housed in a small SOT-323 surface mount package, making it suitable for high-density circuit board designs.

Applications:

  • Low-side switching in portable devices
  • Amplification in small signal circuits
  • Load switching
  • DC-DC converters
  • General-purpose switching applications

Features:

  • PNP Bipolar Junction Transistor (BJT)
  • Low saturation voltage
  • High current gain (hFE)
  • Small SOT-323 surface mount package
  • Lead-free and RoHS compliant

Benefits:

  • Efficient switching performance due to low saturation voltage
  • Improved signal amplification due to high current gain
  • Reduced board space requirements due to small package size
  • Environmentally friendly due to lead-free construction
  • Simplified assembly process for automated manufacturing

Additional Details:

The MMSTA63T146 has a typical collector-emitter voltage (VCEO) rating of -50V and a continuous collector current (IC) rating of -200mA. The DC current gain (hFE) is typically between 100 and 300, allowing for efficient amplification in various circuit configurations. The saturation voltage is low, which minimizes power dissipation during switching. This transistor is commonly used in portable electronic devices such as smartphones, tablets, and wearable devices where space and power efficiency are critical. It is also employed in various industrial and consumer electronic applications requiring small signal amplification or switching. The SOT-323 package provides excellent thermal performance for its size, ensuring reliable operation even at elevated temperatures. The device is designed for automatic placement and soldering, simplifying the manufacturing process.

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