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HD74LS365AFP

Part No HD74LS365AFP
Manufacturer Renesas Electronics America
Catalog OEM Parts (F - I)
Description Buffer/Line Driver 6-CH Non-Inverting 3-ST Bipolar 16-Pin SOP T/R
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1062367-HD74LS365AFP
Categories OEM Parts(F-I)
Manufacturer Renesas Electronics America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian HD74LS365AFP CAD Model

Description

The HD74LS365AFP is a Hex Buffer/Driver with 3-State Outputs from Renesas Electronics America. This device features six independent buffers with individual enable inputs, allowing for selective enabling or disabling of each buffer.

Applications

      
  • Memory Addressing: Used as a buffer for memory address lines, providing increased drive capability.
  •   
  • Data Bus Isolation: Provides isolation between different sections of a data bus.
  •   
  • Multiplexing: Can be used as a multiplexer by selectively enabling different buffers to route data from multiple sources to a single destination.
  •   
  • Line Driving: Drives heavily loaded lines, ensuring signal integrity.
  •   
  • Data Bus Buffering: Used to increase the fan-out of a data bus.

Features

      
  • 3-State Outputs: Allows the output to be in a high, low, or high-impedance state, enabling bus sharing.
  •   
  • High Output Drive Capability: Can drive a large number of loads.
  •   
  • Low Power Consumption: Reduces power dissipation compared to standard TTL devices.
  •   
  • TTL Compatibility: Compatible with other TTL logic devices.
  •   
  • Hex Package: Contains six independent buffers in a single package.

Benefits

      
  • Improved System Performance: Increased drive capability enhances the performance of digital circuits.
  •   
  • Efficient Bus Management: 3-state outputs allow for efficient bus sharing and data routing.
  •   
  • Reduced Power Consumption: Low power dissipation contributes to energy efficiency.
  •   
  • Simplified Circuit Design: Hex package reduces component count and simplifies board layout.
  •   
  • Interoperability: TTL compatibility allows easy integration with existing TTL circuits.

Additional Details

The HD74LS365AFP comes in a DIP package. The switching speeds and other electrical characteristics are detailed in Renesas datasheets. The 3-state outputs are controlled by individual enable inputs, providing flexible control over data flow.

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