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BU400Z-178-HT

Part No BU400Z-178-HT
Manufacturer On Shore Technology Inc.
Catalog Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 40POS GOLD / 40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount
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Category Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
Mfr On Shore Technology Inc.
Series BU-178HT
Package Tube
Product Status Obsolete
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 40 (2 x 20)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 78.7µin (2.00µm)
Contact Material - Mating Beryllium Copper
Mounting Type Surface Mount
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Copper
Contact Finish Thickness - Post Flash
Contact Material - Post Brass
Housing Material Polybutylene Terephthalate (PBT) , Glass Filled
Temperature Range - Operating -55°C ~ 125°C
Termination Post Length 0.059" (1.50mm)
Material Flammability Rating UL94 V-0
Current Rating (Amps) 1 A
Contact Resistance 7mOhm
Base Product Number BU400Z
Standard Package 10
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Win Source Part Number 1340497-BU400Z-178-HT
Ultra Librarian 3D Model Ultra Librarian BU400Z-178-HT CAD Model

Description

The On Shore Technology Inc. BU400Z-178-HT is a 40-pin DIP IC socket.

  • Pitch: 0.100" (2.54mm)
  • Number of Positions: 40
  • For Use With/Related Products: ICs and Transistors
  • Contact Finish Mating: Gold
  • Contact Finish Thickness Mating: 78.7μin (2.00μm)
  • Contact Material Mating: Beryllium Copper
  • Contact Finish Post: Copper
  • Package: Tube
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature: -55°C to 125°C
  • Contact Resistance: 7mOhm

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