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Categories Discrete Semiconductor Products
Manufacturer ON Semiconductor
Type IGBT
Configuration 3 Phase
Current 30A
Voltage 600V
Voltage - Isolation 2500Vrms
Manufacturer Package 27-PowerDIP Module (1.205", 30.60mm)
Family Part Number FSBB30CH60
Manufacturer Pack Quantity 60
MSL Level 1 (Unlimited)
Win Source Part Number 1175887-FSBB30CH60CT
Manufacturer Homepage www.fairchildsemi.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian FSBB30CH60CT CAD Model

Description

ON Semiconductor FSBB30CH60CT Smart Power Module

ON Semiconductor's FSBB30CH60CT is an innovative, high-performance smart power module that integrates multiple power components into a single, compact package. This Motion SPM® 3 series module is designed to enhance the efficiency and reliability of inverter-driven applications such as air conditioners, washing machines, and refrigerators, as well as industrial motor drives and fans.

Key Features

  • Integrated IGBTs: The module features six IGBTs with low saturation voltage and low conduction losses, providing efficient power conversion for three-phase inverter applications.
  • Built-in Bootstrap Diodes: Bootstrap diodes are integrated for the high-side gate drive circuits, simplifying the PCB layout and reducing external component count.
  • Overcurrent Protection: The FSBB30CH60CT is equipped with an overcurrent protection circuit to safeguard the IGBTs from potential damage caused by excessive current.
  • Under-Voltage Lockout: An under-voltage lockout function ensures that the IGBTs operate within their safe voltage range, enhancing system reliability.
  • Isolation: The module offers excellent electrical isolation between the power and control circuits, minimizing the risk of electrical interference.
  • Optimized for Low Electromagnetic Interference (EMI): Careful design and integration reduce EMI, a critical consideration for compliance with regulatory standards.

Efficient Thermal Management

The FSBB30CH60CT comes with a Direct Bonded Copper (DBC) substrate that provides superior thermal performance. This feature ensures efficient heat dissipation, extending the life of the module and the systems in which it is used.

Compact and User-Friendly Design

With its compact footprint, the FSBB30CH60CT is designed to fit into tight spaces, reducing the overall size of the end application. The module's layout is optimized for straightforward PCB design and assembly, making it a user-friendly choice for engineers and designers.

Applications

Due to its robust design and comprehensive set of features, the FSBB30CH60CT is ideal for a variety of applications, including:

  • Home appliances (air conditioners, washing machines, refrigerators)
  • Industrial motor drives
  • Fans and pumps
  • Other inverter-driven applications

The ON Semiconductor FSBB30CH60CT Smart Power Module represents a leap forward in the integration of power circuitry, offering a high level of performance and ease of use for designers looking to optimize their power systems.

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