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SPC5777CK2MMO3R

Part No SPC5777CK2MMO3R
Manufacturer NXP / Nexperia
Catalog Embedded - Microcontrollers
Description IC MCU 32BIT 8MB FLASH 516MAPBGA / e200z7 series Microcontroller IC 32-Bit Tri-Core 264MHz 8MB (8M x 8) FLASH 516-MAPBGA (27x27)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr NXP USA Inc.
Series MPC57xx
Product Status Obsolete
Core Processor e200z7
Core Size 32-Bit Tri-Core
Speed 264MHz
Connectivity EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
RAM Size 512K x 8
Supply Voltage - Operating 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 125°C (TA)
Mounting SMD (SMT)
Package / Case 516-BGA
Supplier Device Package 516-MAPBGA (27x27)
Base Product Number SPC577
Standard Package 200
MSL Level 3 (168 Hours)
ECCN 5A002A1
Win Source Part Number 1263901-SPC5777CK2MMO3R
Ultra Librarian 3D Model Ultra Librarian SPC5777CK2MMO3R CAD Model

Description

Introducing the SPC5777CK2MMO3R Microcontroller from NXP

The SPC5777CK2MMO3R is a state-of-the-art microcontroller unit (MCU) designed by NXP Semiconductors, tailored for the automotive industry's demanding applications. This high-performance MCU is part of NXP's Power Architecture line of processors, which are renowned for their robust performance and reliability in automotive and industrial control systems.

Key Features

  • Advanced Processing Core: The SPC5777CK2MMO3R is equipped with a dual-core Power Architecture e200z7, running at speeds of up to 264 MHz, providing the computational horsepower required for complex automotive applications such as powertrain, chassis, and advanced driver assistance systems (ADAS).
  • Memory Resources: It boasts a generous memory capacity, including up to 4MB of flash memory and 384KB of RAM, ensuring ample space for application code and data storage.
  • Enhanced Safety Features: With integrated safety features that comply with the ISO 26262 standard, the MCU is designed to meet the stringent requirements for functional safety in road vehicles. This includes features such as Error Correction Code (ECC) on both flash and RAM, and a built-in self-test capability.
  • Rich Set of Peripherals: The device includes a variety of peripherals such as multiple CAN interfaces, LIN, FlexRay, and Ethernet for communication, along with numerous timers, ADCs, and PWM channels for control applications.
  • Low Power Consumption: Despite its powerful performance, the SPC5777CK2MMO3R is designed to be energy-efficient, with low power modes to minimize consumption when full power is not required.

Robust Design for Automotive Use

The SPC5777CK2MMO3R is built to withstand the harsh conditions of automotive environments. It operates over an extended temperature range and is engineered to be resistant to the vibrations and shocks commonly encountered in automotive applications. The package is designed for optimal heat dissipation, ensuring reliable performance over a vehicle's lifespan.

Developer Support and Ecosystem

NXP provides comprehensive support for developers working with the SPC5777CK2MMO3R, including software drivers, development tools, and reference designs. The MCU is supported by a wide range of development environments and tools from both NXP and third-party vendors, simplifying the design process and accelerating time-to-market for automotive systems developers.

With its powerful features and robust design, the SPC5777CK2MMO3R from NXP is the ideal choice for automotive engineers looking to develop the next generation of vehicle control systems.

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